Q: Is the adhesive application uneven? Is the bond secure?

A: The squeegee is designed at a specific angle to ensure more even adhesive application; the application mechanism utilises a servo motor and pressure control to maintain a uniform adhesive layer thickness. Furthermore, we have fitted dust removal and heating devices for the substrate, which clean and preheat the substrate prior to adhesive application, thereby enhancing the adhesive’s adhesion. The bond is extremely secure and will not delaminate.